Auto material cutting machine, cut sheet size 37*49inch, 41*49inch, 43*49inch to working PNL size.
Check point:
1.Base Material Type
2.Dimension
3.No Dent、No Scratch
4.Quantity

laser direct imaging
Check point:
1.Correct CAM data

Auto exposure machine
Check point:
1.Energy
2.Vacuity
3.Environment
Develop check point:
1.Temperature
2.Pressure
3.Concentration

After development, the non-product copper is etched away.
Check point:
1.Temperature
2.Speed、Pressure
3.Concentration
4.Line width/space

AOI(Automatic Optic Inspection)
Check point:
1.Open/short
2.Copper Residue

Mechanical drilling
Check point:
1.Hole Size
2.Hole Wall Roughness
3.Registration
4.The amount of holes
5.Appearance

Laser drilling, drill micro via holes
Check point:
1.Laser drill completely
2.Hole diameter寸
3.Hole shape

Plasma desmer
Check point:
1.Plasma parameters
2.Mixed gas species
3.Power energy
4.Working pressure, processing time and gas flow rate

Plate through holes
Check point:
1.Temperature
2.Concentration
3.Plating Rate
4.Back Light Test

Horizontal plating
Check point:
1.Temperature
2.Concentration
3.Current Density

Vertical plating
Check point:
1.Temperature
2.Concentration
3.Current Density

laser direct imaging
Check point:
1.Correct CAM data

Auto exposure machine
Check point:
1.Energy
2.Vacuity
3.Environment

Pattern plating
Check point:
1.Temperature
2.Concentration
3.Current Density
4.Check scratching the tin on the lines
Quality check point:
1.Hole Wall Thk.
2.Surface Copper Thk.
3.Apperance

The non-product copper is etched away.
Check point:
1.Temperature
2.Speed
3.Pressure
3.Concentration
4.Line width/space

AOI(Automatic Optic Inspection)
Check point:
1.Open/short
2.Copper Residue

Spry coating line
Check point:
1.No Exposure copper
2.No Mask on Pad
3.No Scratch, Scum

Auto-printing
Check point:
1.correct CAM data
2.Registration
3.Definition
4.No scratching

Immersion Gold
Check point:
1.Temperature
2.Concentration


Quality check point:
1.Au / Ni thickness
2.Phosphorus percent
3.Apperance

Hot air leveling
Check point:
1.Angle of Air Knives
2.Solder Bath Temp.
3.Air Knives Temp.
Quality check point:
1.Sn/Pb Thinkness
2.Apperance

CNC routing for finish board size
Check point:
1.Dimension
2.No Powder Residue
3.No Scratch

Flying probe tester
Check point:
1.Open
2.Short
3.Circumferential Separation

Fanal quality control, visual inspection
Check point:
1.Scratching
2.Crease 3.Oxidation
4.Solder deviation
5.Drill deviation
6.Conductor nick
7.Copper residue and so on

SIR Oven
Surface insulation resistance testing

Thermal cycling chamber
Thermal cycling testing

3D Dimension

X-ray measuring instrument Measuing gold thickness, nickel thickenss, solder thickness and so on

D/F Lamination & Exposure：
Graphic transfer
Check Ponit:
Film transmittance/expansion/contraction/appearance and revision

D.E.S：
Graphic transfer
Check Ponit:
Trace width/Trace space/open/short

AOI：
Automated Optical Inspection
Check Ponit:
Open/Short

Coverlay：
Paste insulation protective film
Check Ponit:
Missing opening/Offset/Excessive glue/CL On pad/Dust/Copper Exposed

Black/brown oxygen：
To increases the joint force between each layer for mulitlayer

Lay up：
Stack up each layer for multilayer
Check Ponit:
Offset/Foreign matter

Lamination：
By high temperature and high pressure makes each layer get together
Check Ponit:
Thickness/Delamination/Layers of board

NC Drilling：
Drill hole for basefilm/stiffener/coverlay
Check Ponit:
Hole diameter/degree of deviation/quanity of holes

Plasma：
Desmear process

PTH:
Ensure the conduction of each layer
Check Ponit:
Copper thickness and back light

D/F Lamination & Exposure
：Graphic transfer
Check Ponit:
Film transmittance/expansion/contraction/appearance and revision

D.E.S：
Graphic transfer
Check Ponit:
Trace width/Trace space/open/short

LPI：
Print solder resist ink
Check Ponit:
SM on pad/Missing SM/SM off normal/Dust/No developing cleanness

Surface finish:
Plating metal protective film on pads,it's protect pads,and convenient in SMT
Check Ponit:
Exposured copper/Gold thickness

Silksreen:
Print Comp Symbols and logos on board
Check Ponit:
Legend on pad/Legend obscure

ET:
Ensure electrical function, avoid open/short circuit
Check Ponit:
Open/Short

Assembing:
Paste Stiffener(PI/FR4/AL/SUS) and tape
Check Ponit:
Offset/Excessive glue/Dust

Punching/Routing:
Cutting the profile of board
Check Ponit:
Dimension

FQC:
Final Quality Control For Product
Check Ponit:
Appearance inspection

Packing:
Protection products, to avoid damage in transit