PCB/FPC Assembly

    Equipment

    Manufacturer

    Model

    Quantity

    Manufacturering Capability

    SMT Lines

    4

    DIP Lines

    7

    Solder paste Printer machine

    BESTIME

    T1010A

    4

    Max. Board Size: 410*360*4mm

    Glue dispenser machine

    JUKI

    Kd2077

    4

    Chip mounter machine

    JUKI

    FX-3

    4

    1)For chip components such as resistors, capacitors, etc.. Speed: 36,000CPH
    2)0402 chips in MC (Capable 0201/01005 chips)

    IC mounter machine

    JUKI

    2080

    4

    1)For IC, BGA, etc.. Speed: 11,000CPH
    2)Fine Pitch Component 0.5 mm (Capable 0.3 mm)
    3)BGA 0.5mm pitch,256 Balls in MC (Capable 0.3 mm)

    Reflow Soldering Machine

    JT

    NS1000

    4

    AOI Machine

    Omron

    VT-RNS2

    4

    Desktop High speed Automated Optical Inspection machine. Inspection items: missing, shift, miss alignment, reverse, polarity, other component, bridge, dirt, dust, no solder, short solder, cold solder, lifted chip, lifted lead, un-insertion. OCR: optical character recognition/verification. After Printing Process: No solder paste, excess, blur, scratch, short, shift, bridge.

    Axial Insertion Machine

    Panasonic

    AV131

    2

    Radial Insertion Machine

    Panasonic

    RL132

    1

    Wave Soldering Machine

    JT

    JT350

    7

    ICT machine

    JET

    JET300

    7

    Critical Quality Test

    3D Test Equipment
    X-RAY Test Equipment
    Environment Test Equipment( Including High Temperature & Humidity、Low Temperature & Humidity、Temperature & Humidity Cycle Test)
    ICT
    FCT
    Burn In Test

    Quality Standard

    IPC-610D

    • Sampling Inspection:
      PCB & Mechanical Parts AQL
      PCB...0.25 MA, 0.65 MI
      MECH...0.65 MA, 2.50 MI

    • Condition:
      125℃ 2H
      After remove moisture, ensure product quality, easy to operation

    • Automated Under Screen Cleaner
      2D Optical Screening
      Check point:
      No solder paste, excess, blur, scratch, short, shift, bridge.

    • Attaching chip components to the surface of the board. Board pads are soldered. No holes used in process.
      Check point:missing, shift, miss alignment, reverse, polarity, other component, bridge, dirt, dust

    • Make the boards and components fully combined

    • Desktop High speed Automated Optical Inspection machine.
      Inspection items:
      missing, shift, miss alignment, reverse, polarity, other component, bridge, dirt, dust, no solder, short solder, cold solder, lifted chip, lifted lead, un-insertion.
      OCR: optical character recognition/verification.
      After Printing Process:
      No solder paste, excess, blur, scratch, short, shift, bridge.

    • Process of inserting axial & radial components on Printed Circuit Board
      Check point:
      missing, shift, reverse, polarity, other component, bridge, dirt, dust

    • Make the boards and components fully combined

    • Retouch of components soldering

    • 100% Test Inspection