PCB/FPC osazování

    Technologie

    Výrobce

    Model

    Množství

    Technická způsobilost

    SMT Linky

    4

    DIP Linky

    7

    Sítotisk

    BESTIME

    T1010A

    4

    Max. rozměr desky: 410*360*4mm

    Glue dispenser

    JUKI

    Kd2077

    4

    Chip SMT

    JUKI

    FX-3

    4

    1)Chip komponenty – odpory, kondenzátory, atd.. Rychlost: 36,000CPH
    2)0402 pouzdra v MC (možno 0201/01005 pouzdra)

    IC SMT

    JUKI

    2080

    4

    1)Pro IC, BGA, etc.. Rychlost: 11,000CPH
    2)Fine Pitch Component 0.5 mm (možno 0.3 mm)
    3)BGA 0.5mm pitch,256 Balls in MC (možno 0.3 mm)

    Reflow Pájení

    JT

    NS1000

    4

    AOI Kontrola

    Omron

    VT-RNS2

    4

    Desktop High Speed verze

    Axial osazení

    Panasonic

    AV131

    2

    Radial osazení

    Panasonic

    RL132

    1

    Pájení vlnou

    JT

    JT350

    7

    ICT test

    JET

    JET300

    7

    Interní laboratoř


    3D Test
    X-RAY Test
    Cyklické testování (teplota, vlhkost, prašnost, atd.)
    ICT
    FCT
    Burn In Test

    Quality Standard


    IPC-610D

    • Sampling Inspection:
      PCB & Mechanical Parts AQL
      PCB...0.25 MA, 0.65 MI
      MECH...0.65 MA, 2.50 MI

    • Condition:
      125℃ 2H
      After remove moisture, ensure product quality, easy to operation

    • Automated Under Screen Cleaner
      2D Optical Screening
      Check point:
      No solder paste, excess, blur, scratch, short, shift, bridge.

    • Attaching chip components to the surface of the board. Board pads are soldered. No holes used in process.
      Check point:missing, shift, miss alignment, reverse, polarity, other component, bridge, dirt, dust

    • Make the boards and components fully combined

    • Desktop High speed Automated Optical Inspection machine.
      Inspection items:
      missing, shift, miss alignment, reverse, polarity, other component, bridge, dirt, dust, no solder, short solder, cold solder, lifted chip, lifted lead, un-insertion.
      OCR: optical character recognition/verification.
      After Printing Process:
      No solder paste, excess, blur, scratch, short, shift, bridge.

    • Process of inserting axial & radial components on Printed Circuit Board
      Check point:
      missing, shift, reverse, polarity, other component, bridge, dirt, dust

    • Make the boards and components fully combined

    • Retouch of components soldering

    • 100% Test Inspection