Assembly

    Technologie

    Hersteller

    Model

    Menge

    Technische Kompetenz


    SMT Linien

    4
    		                           

    DIP Linien



    7


    Siebdruck

    BESTIME

    T1010A

    4

    Max. Ausmaß der Platte: 410*360*4mm

    Glue dispenser

    JUKI

    Kd2077

    4


    Chip SMT

    JUKI

    FX-3

    4

    1) Chip Komponente – Widerstände, Kondensatoren, usw. Geschwindigkeit: 36,000CPH 2)
                               2)0402 Gehäuse in MC (möglich 0201/01005 Gehäuse)

    IC SMT

    JUKI

    2080

    4

    1) Für IC, BGA, usw. Geschwindigkeit: 11,000CPH
                               2)Fine Pitch Component 0.5 mm (möglich 0.3 mm)
                               3)BGA 0.5mm pitch,256 Balls in MC (möglich 0.3 mm)

    Reflow Löten

    JT

    NS1000

    4


    AOI Kontrolle

    Omron

    VT-RNS2

    4

    Desktop High Speed Version

    Axial Einfassung

    Panasonic

    AV131

    2


    Radial Einfassung

    Panasonic

    RL132

    1


    Wellenlöten

    JT

    JT350

    7


    ICT Test

    JET

    JET300

    7


    Internes Labor


    3D Test
                               X-RAY Test  
                               Zyklisches Testen( Temperatur & Feuchtigkeit & Staubigkeit & usw)
                               ICT
                               FCT
                               Burn In Test

    Quality Standard




    IPC-610D

    •                          

      Sampling Inspection:

      PCB & Mechanical Parts AQL

      PCB...0.25 MA, 0.65 MI

      MECH...0.65 MA, 2.50 MI

    •                          

      Condition:125℃ 2H After remove moisture, ensure product quality, easy to operation

    •                          

      Automated Under Screen Cleaner 2D Optical Screening

    •                          

      Attaching chip components to the surface of the board. Board pads are soldered. No holes used in process.

    •                          

      Make the boards and components fully combined

    •                          

      Desktop High speed Automated Optical Inspection machine. Inspection items: missing, shift, miss alignment, reverse, polarity, other component, bridge, dirt, dust, no solder, short solder, cold solder, lifted chip, lifted lead, un-insertion. OCR: optical character recognition/verification. After Printing Process: No solder paste, excess, blur, scratch, short, shift, bridge.

    •                          

      Process of inserting axial & radial components on Printed Circuit Board

    •                          

      Lead of inserted components in manual insert are cut

    •                          

      Make the boards and components fully combined

    •                          

      Retouch of components soldering

    •                          

      100% Test Inspection